485熔锡炉 流动焊锡锅 锡槽HAKKO白光焊接拆焊
SpecificationsModel No.485Power consumption850 WTemperature rangeNormal temperature to 300℃Temperature stability±2℃Molten solder capacity10 kg of Sb-Pb solder, about 9 kgof Pb-free solderDimensions500
SpecificationsModel No.485Power consumption850 WTemperature rangeNormal temperature to 300℃Temperature stability±2℃Molten solder capacity10 kg of Sb-Pb solder, about 9 kgof Pb-free solderDimensions500
| Model No. | 485 |
|---|---|
| Power consumption | 850 W |
| Temperature range | Normal temperature to 300℃ |
| Temperature stability | ±2℃ |
| Molten solder capacity | 10 kg of Sb-Pb solder, about 9 kgof Pb-free solder |
| Dimensions | 500 (W) × 245 (H) × 550 (D) mm |
| Weight | 35 kg |
| Air supply pressure | 0.196 to 0.686 Mpa (2 to 7 kgf/cm2) |
|---|---|
| Dimensions | 150 (W) × 100 (H) × 300 (D) mm |
| Weight | 3.5 kg |
Weight is measured without solder and cord.
Solder is not included when factory setting.