485熔锡炉 流动焊锡锅 锡槽HAKKO白光焊接拆焊
SpecificationsModel No.485Power consumption850 WTemperature rangeNormal temperature to 300℃Temperature stability±2℃Molten solder capacity10 kg of Sb-Pb solder, about 9 kgof Pb-free solderDimensions500
SpecificationsModel No.485Power consumption850 WTemperature rangeNormal temperature to 300℃Temperature stability±2℃Molten solder capacity10 kg of Sb-Pb solder, about 9 kgof Pb-free solderDimensions500
Model No. | 485 |
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Power consumption | 850 W |
Temperature range | Normal temperature to 300℃ |
Temperature stability | ±2℃ |
Molten solder capacity | 10 kg of Sb-Pb solder, about 9 kgof Pb-free solder |
Dimensions | 500 (W) × 245 (H) × 550 (D) mm |
Weight | 35 kg |
Air supply pressure | 0.196 to 0.686 Mpa (2 to 7 kgf/cm2) |
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Dimensions | 150 (W) × 100 (H) × 300 (D) mm |
Weight | 3.5 kg |
Weight is measured without solder and cord.
Solder is not included when factory setting.