HAKKO白光

485熔锡炉 流动焊锡锅 锡槽HAKKO白光焊接拆焊

SpecificationsModel No.485Power consumption850 WTemperature rangeNormal temperature to 300℃Temperature stability±2℃Molten solder capacity10 kg of Sb-Pb solder, about 9 kgof Pb-free solderDimensions500

Specifications

Model No.485
Power consumption850 W
Temperature rangeNormal temperature to 300℃
Temperature stability±2℃
Molten solder capacity10 kg of Sb-Pb solder, about 9 kgof Pb-free solder
Dimensions500 (W) × 245 (H) × 550 (D) mm
Weight35 kg


 

Air Unit

Air supply pressure0.196 to 0.686 Mpa (2 to 7 kgf/cm2)
Dimensions150 (W) × 100 (H) × 300 (D) mm
Weight3.5 kg
  • Weight is measured without solder and cord.

  • Solder is not included when factory setting.


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